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US 2022/0028689 A1Published application
Method for Forming Semiconductor Layer
AssigneeNippon Telegraph and Telephone Corporation
InventorsRyo Nakao, Tomonari Sato
Life of this patent
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Abstract
In an embodiment, a first recess and a second recess, designed to reach a first semiconductor layer, are formed in the portions of a first threading dislocation and a second threading dislocation having reached the surface. Further, the first semiconductor layer is oxidized through the first recess and the second recess to form an insulating film configured to cover the lower surface of a second semiconductor layer.
Claims8
-6. (canceled)
A method for forming a semiconductor layer, the method comprising:
- (i) crystal-growing, on a substrate, a first semiconductor layer, the first semiconductor layer having a lattice constant in a planar direction of a surface of the substrate which is different from a lattice constant of the substrate in the planar direction of the surface of the substrate;
- (ii) crystal-growing a second semiconductor layer on the first semiconductor layer;
- (iii) selectively dissolving the second semiconductor layer to form a recess at a dislocation portion of the second semiconductor layer, the recess reaching the first semiconductor layer;
- (iv) oxidizing the first semiconductor layer through the recess and forming an insulating film covering a lower surface of the second semiconductor layer;
- and
- (v) crystal-regrowing the second semiconductor layer after forming the insulating film.
3 more elements
Dependencies are inferred from the claim text.