Ceramic electronic device and manufacturing method of the same

A manufacturing method of a ceramic electronic device comprising:

• preparing a multilayer structure having a parallelepiped shape in which two or more units are stacked, each of the units having a structure in which a metal conductive paste is provided on a green sheet including a main component ceramic;
• and
• firing the multilayer structure,
• wherein, in the multilayer structure prepared before the firing, a plurality of first layers made of the metal conductive paste and a plurality of second layers made of the metal conductive paste are alternately stacked with the green sheet interposed therebetween in a stacking direction,
• wherein adjacent to an end face of the multilayer structure, each of the plurality of first layers has a gap of a length of 30 μm or less dividing the first layer along a lateral direction that is perpendicular to the stacking direction, the gap not reaching said end face, and
• wherein adjacent to the end face of the multilayer structure, each of the plurality of second layers has no gap dividing the second layer along the lateral direction.