Method for producing resin mold-type electronic component and resin mold-type electronic component
AssigneeTDK Corporation
InventorKosuke YAZAWA
Life of this patent
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Abstract
A method for producing a resin mold-type electronic component in which an electronic component main body is covered with a mold resin includes preparing a first mold resin provided with a metal terminal, having an accommodating portion for the electronic component main body, and having a joining material filling space to be filled with a joining material, accommodating the electronic component main body in the accommodating portion of the first mold resin, and joining the metal terminal and a terminal electrode of the electronic component main body by filling the joining material filling space with the joining material.
Claims16
A method for producing a resin mold-type electronic component in which an electronic component main body is covered with a mold resin, the resin mold-type electronic component producing method comprising:
- preparing a first mold resin provided with a metal terminal, having an accommodating portion for the electronic component main body, and having a joining material filling space to be filled with a joining material;
- accommodating the electronic component main body in the accommodating portion of the first mold resin;
- and
- joining the metal terminal and a terminal electrode of the electronic component main body by filling the joining material filling space with the joining material.
A method for producing a resin mold-type electronic component in which an electronic component main body is covered with a mold resin, the resin mold-type electronic component producing method comprising:
- covering the electronic component main body with a first mold resin provided with a metal terminal to be joined to a terminal electrode of the electronic component main body;
- and
- covering the electronic component main body with a second mold resin.
A resin mold-type electronic component comprising:
- an electronic component main body having a terminal electrode;
- a metal terminal joined to the terminal electrode via a joint portion;
- and
- a mold resin covering the electronic component main body and the joint portion and pulling a part of the metal terminal to the outside,
- wherein the joint portion is disposed on a mounting surface side with respect to the electronic component main body in the mold resin and joins the metal terminal and the terminal electrode at the position.
A resin mold-type electronic component comprising:
- an electronic component main body having a terminal electrode;
- a metal terminal joined to the terminal electrode;
- and
- a mold resin covering the electronic component main body,
- wherein the metal terminal extends from the terminal electrode toward a mounting surface and extends outward from the mold resin.
Dependencies are inferred from the claim text.