Integrated magnetic assembly

A magnetic assembly, comprising:

• a multilevel package substrate having a first level, a second level, and a third level, the first, second, and third levels each having patterned conductive features and molded dielectric features;
• the first level including a first patterned conductive feature with multiple turns that form a first winding having a first end and a second end;
• the second level including a second patterned conductive feature;
• and
• the third level including a third patterned conductive feature with multiple turns that form a second winding having a first end and a second end.

A method for fabricating an electronic device, the method comprising:

• fabricating a multilevel package substrate, including:
• forming a first level on a carrier structure, the first level having first molded dielectric features and a first patterned conductive feature with multiple turns that form a first winding,
• forming a second level on the first level, the second level having second patterned conductive features and second molded dielectric features,
• forming a third level on the second level, the third level having third molded dielectric features and a third patterned conductive feature with multiple turns that form a second winding, and
• removing the carrier structure from the first level;
• performing an electrical connection process that couples a first die and the first winding in a first circuit, and couples a second die and the second winding in a second circuit isolated from the first circuit;
• and
• performing a molding process that encloses a portion of the multilevel package substrate and the first and second dies in a package structure.