Image controller and semiconductor package
AssigneeSamsung Display Co., Ltd.
InventorBon Seog Gu
Life of this patent
Estimating the term…
Abstract
An image controller includes: a first semiconductor circuit configured to generate a third compensation data obtained by applying a first image compensation to an input image data; a second semiconductor circuit configured to generate a first compensation data obtained by applying a second image compensation different from the first image compensation to the input image data; and a sensing unit configured to generate a temperature sensing data by measuring a temperature of the second semiconductor circuit. The first semiconductor circuit determines whether an operation of the second semiconductor circuit is to be off based on the temperature sensing data.
Claims20
An image controller, comprising:
- a first semiconductor circuit configured to generate a third compensation data obtained by applying a first image compensation to an input image data;
- a second semiconductor circuit configured to generate a first compensation data obtained by applying a second image compensation different from the first image compensation to the input image data;
- and
- a sensing unit configured to generate a temperature sensing data by measuring a temperature of the second semiconductor circuit;
- wherein the first semiconductor circuit determines whether an operation of the second semiconductor circuit is to be off based on the temperature sensing data.
A semiconductor package, comprising:
- a first package including a first semiconductor circuit configured to generate a third compensation data obtained by applying a first image compensation to an input image data;
- a second package including a second semiconductor circuit configured to generate a first compensation data obtained by applying a second image compensation different from the first image compensation to the input image data, the second package being disposed above the first package;
- and
- at least one thermal sensor disposed in a predetermined sensing area on the second semiconductor circuit and configured to measure a temperature of the second semiconductor circuit,
- wherein the first semiconductor circuit determines whether an operation of the second semiconductor circuit is to be off, based on the temperature of the second semiconductor circuit, which is measured by the at least one thermal sensor.
A semiconductor package, comprising:
- a first package including a first semiconductor circuit configured to generate a third compensation data obtained by applying a first image compensation to an input image data;
- a second package including a second semiconductor circuit configured to generate a first compensation data obtained by applying a second image compensation different from the first image compensation to the input image data, the second package being disposed above the first package;
- at least one thermal sensor configured to measure a temperature of the second semiconductor circuit;
- and
- a third package including a memory configured to store a compensation parameter corresponding to the second image compensation, the third package being disposed above the first package,
- wherein the third package includes a substrate supporting the memory, and the third package being electrically connected to the memory.
Dependencies are inferred from the claim text.