Payment card and method for fabricating the same
AssigneeICK International, Inc.
InventorSoo Hyang KANG
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a payment card which includes the steps of forming a shield layer which includes ferromagnetic material; forming an inlay wherein the inlay includes an antenna and an interior edge forming a hole; forming a metal layer which includes a recess sized to receive the shield layer; and placing the shield layer into the recess of the metal layer. The shield layer further includes an opening sized to receive an integrated circuit (“IC”) chip. The recess is formed within a boundary of the metal layer and on a first side of the metal layer, the recess including an opening through to a second side of the metal layer. The opening of the recess and the opening of the shield layer are sized to receive the IC chip, of which includes a contact area.
Claims20
A method for manufacturing a payment card, comprising:
- forming a shield layer which includes ferromagnetic material;
- forming an inlay wherein the inlay includes an antenna and an interior edge forming a hole;
- forming a metal layer which includes a recess sized to receive the shield layer;
- and
- placing the shield layer into the recess of the metal layer,
- wherein the shield layer further includes an opening sized to receive an integrated circuit (“IC”) chip,
- wherein the recess is formed within a boundary of the metal layer and on a first side of the metal layer,
- wherein the recess includes an opening through to a second side of the metal layer,
- wherein the opening of the recess and the opening of the shield layer are sized to receive the IC chip, and
- wherein the IC chip includes a contact area.
A payment card comprising:
- a metal layer which includes a boundary and a recess formed within the boundary;
- an inlay which includes an antenna;
- a shield layer positioned between the inlay and the metal layer;
- an integrated circuit (“IC”) chip including a contact area, wherein the contact area contacts the antenna of the inlay;
- and
- a back sheet constructed to cover the IC chip, the inlay, the shield layer, and the metal layer,
- wherein the recess is constructed to receive the shield layer, the IC chip, and the inlay,
- wherein the recess and the shield layer include holes sized to receive the IC chip, and
- wherein the inlay includes an interior edge forming a hole.
Dependencies are inferred from the claim text.