Fingerprint sensor package and smart card including the same

A fingerprint sensor package comprising:

• a package substrate;
• and
• a controller integrated circuit (IC) mounted on the package substrate and configured to determine whether a registered fingerprint matches a sensed fingerprint,
• wherein the package substrate comprises:
• a base layer;
• an upper insulating layer disposed on a first surface of the base layer;
• a lower insulating layer disposed on a second surface of the base layer;
• an upper protective layer disposed on the upper insulating layer;
• a lower protective layer disposed on the lower insulating layer;
• first conductive patterns covered by the lower protective layer, and comprising first ground patterns, power patterns, signal patterns, first pads, and second pads;
• second conductive patterns disposed on the lower insulating layer, and comprising second ground patterns, third pads, and fourth pads, wherein the second ground patterns are connected to the first ground patterns, wherein the third pads are connected to the first pads, and wherein the fourth pads are connected to the second pads;
• third conductive patterns covered by the upper insulating layer, and comprising third ground patterns, first sensing patterns, and fifth pads, wherein the third ground patterns are connected to the second ground patterns, wherein the first sensing patterns are connected to the third pads and extending in a first direction parallel to an upper surface of the package substrate, and wherein fifth pads are connected to the fourth pads;
• and
• fourth conductive patterns covered by the upper protective layer, and comprising fourth ground patterns and second sensing patterns, wherein the fourth ground patterns are connected to the third ground patterns, wherein the second sensing patterns are connected to the fifth pads, and wherein the fourth conductive patterns extends in a second direction that crosses the first direction and is substantially parallel to the upper surface of the package substrate,
• wherein a sensing region and an edge region surrounding the sensing region are provided on the package substrate,
• wherein the first and second sensing patterns are disposed in the sensing region,
• the upper protective layer comprises upper openings that expose a portion of the fourth ground patterns, and
• the lower protective layer comprises lower openings that expose portions of each of the first ground patterns, the power patterns, and the signal patterns.

A fingerprint sensor package comprising:

• a package substrate;
• and
• a controller integrated circuit (IC) mounted on the package substrate and configured to determine whether a registered fingerprint matches a sensed fingerprint,
• wherein the package substrate comprises:
• first conductive patterns comprising first ground patterns, power patterns, signal patterns, first pads, and second pads, wherein the first ground patterns receive a reference potential, wherein the power patterns receive a power potential, wherein the signal patterns are configured to output a signal of the controller IC, and wherein the first conductive patterns are connected to the controller IC;
• second conductive patterns comprising second ground patterns, third pads, and fourth pads, wherein the second ground patterns are connected to the first ground patterns, wherein the third pads are connected to the first pads, wherein the fourth pads are connected to the second pads, and wherein the second conductive patterns are disposed on the first conductive patterns;
• third conductive patterns comprising third ground patterns, first sensing patterns, fifth pads, wherein the third ground patterns are connected to the second ground patterns, wherein the first sensing patterns have a line shape extending in a first direction parallel to an upper surface of the package substrate and are connected to the third pads, wherein the fifth pads are connected to the fourth pads, and wherein the third conductive patterns are disposed on the second conductive patterns;
• and
• fourth conductive patterns comprising fourth ground patterns and second sensing patterns, wherein the fourth ground patterns are connected to the third ground patterns, and wherein the second sensing patterns have a line shape extending in a second direction, which is parallel to the upper surface of the package substrate and crosses the first direction, and are connected to the fifth pads, and wherein the fourth conductive patterns are disposed on the third conductive patterns,
• wherein a sensing region and an edge region surrounding the sensing region are provided on the package substrate,
• wherein the first and second sensing patterns are disposed in the sensing region, and
• wherein the third and fourth ground patterns are disposed in the edge region.