Temperature control system and temperature control method

Abstract

A temperature control system and method are provided. The temperature control system includes: a bearing platform including a central platform and multiple edge platforms arranged around same; multiple temperature control modules each connected to a respective edge platform and configured to regulate temperature of a corresponding region of a wafer on the edge platform; a parameter acquisition module configured to acquire temperatures of the wafer; and a processing module configured to acquire a temperature abnormal region of the wafer and regulate a temperature of the temperature control module corresponding to the temperature abnormal region. The parameter acquisition module is used to acquire the temperatures of the wafer on the bearing platform, to acquire the temperature abnormal region of the wafer. Then, the processing module acquires the corresponding temperature control module based on the position of the temperature abnormal region. The temperatures at specific positions of a wafer are accurately controlled.

Dependencies are inferred from the claim text.