Photosensitive resin composition, method for producing resist pattern film, and method for producing plated formed product
AssigneeJsr Corporation
InventorsYuka SANO, Tomoyuki MATSUMOTO, Hirokazu SAKAKIBARA
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Abstract
An object of the present invention is to provide a photosensitive resin composition for suppressing standing wave traces and forming a resist pattern film having a rectangular cross section. The photosensitive resin composition of the present invention contains polymer (A) having an acid dissociative group; photoacid generator (B); carbamic acid ester (C) having a hydroxyl group; and solvent (D), the solvent (D) containing at least one solvent (D1) selected from, for example, propylene glycol monomethyl ether acetate and at least one solvent (D2) selected from, for example, dipropylene glycol dimethyl ether.
Claims19
A photosensitive resin composition comprising:
- a polymer (A) having an acid dissociative group;
- a photoacid generator (B);
- a carbamic acid ester (C) having a hydroxyl group;
- and a solvent (D),
- the solvent (D) comprising:
- at least one solvent (D1) selected from the group consisting of propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, ethyl lactate, methyl 3-methoxypropionate, and cyclohexanone;
- and
- at least one solvent (D2) selected from the group consisting of dipropylene glycol dimethyl ether, dipropylene glycol methyl ethyl ether, dipropylene glycol diethyl ether, dipropylene glycol methyl ether acetate, dipropylene glycol ethyl ether acetate, 3-methoxybutyl acetate, 1,4-butanediol diacetate, and 1,3-butylene glycol diacetate.
Dependencies are inferred from the claim text.