Shorting bar and manufacturing method thereof, array substrate, and display device

A manufacturing method of a shorting bar, comprising:

• forming a test signal wiring layer on a substrate;
• forming an insulating layer on the substrate on which the test signal wiring layer is formed;
• forming a signal lead layer on the substrate on which the insulating layer is formed;
• forming a protective layer on the substrate on which the signal lead layer is formed;
• and
• forming a bonding lead layer on the substrate on which the protective layer is formed;
• wherein, the test signal lines are made of a transparent conductive material, and a coverage region of the insulating layer and a coverage region of the protective layer are staggered from coverage regions of the test signal lines;
• or, the signal leads are made of the transparent conductive material, the coverage region of the protective layer is staggered from coverage regions of the signal leads;
• or, the protective layer is arranged with a plurality of first through holes, and the first through holes correspond to the signal leads in a one-to-one correspondence, and are located directly above the signal leads, and the first through holes are filled with the transparent conductive material so that the signal leads can be disconnected by acid pickling.

An array substrate, comprising a display region and a non-display region, the non-display region comprising a test region, and a shorting bar being arranged in the test region;

• the shorting bar comprising a test signal wiring layer, an insulating layer, a signal lead layer, a protective layer and a bonding lead layer that are sequentially stacked, the test signal wiring layer being arranged with test signal lines, and the signal lead layer being arranged with signal leads;
• wherein, the test signal lines are made of a transparent conductive material, and a coverage region of the insulating layer and a coverage region of the protective layer are staggered from coverage regions of the test signal lines;
• or, the signal leads are made of the transparent conductive material, the coverage region of the protective layer is staggered from coverage regions of the signal leads;
• or, the protective layer is arranged with a plurality of first through holes, and the first through holes correspond to the signal leads in a one-to-one correspondence, and are located directly above the signal leads, and the first through holes are filled with the transparent conductive material so that the signal leads can be disconnected by acid pickling.