Managing Adhesive Curing for Photonic System Assembly

A method for assembling a photonic system comprising a photonic integrated circuit (PIC) comprising a first waveguide and a photonic component comprising a second waveguide, the method comprising:

• supporting the PIC on a support structure such that an edge surface of the PIC in proximity to an end of the first waveguide is accessible;
• providing an optical wave into the first waveguide or the second waveguide;
• monitoring a portion of the optical wave coupled into the first waveguide from the second waveguide or into the second waveguide from the first waveguide while aligning an edge surface of the photonic component to be flush with the edge surface of the PIC using a pick-up tool configured to move the photonic component;
• and
• providing at least a portion of at least one received beam of ultraviolet light to cure an adhesive between the edge surface of the photonic component and the edge surface of the PIC, wherein
• at least about 50% of the received beam of ultraviolet light is transmitted through an optically transmissive portion of the pick-up tool, and
• at least a portion of the ultraviolet light transmitted through the pick-up tool is incident upon an edge surface of the PIC at an angle of incidence that is less than about 60 degrees.