Radar module incorporated with a pattern-shaping device
AssigneeMediatek Inc.
InventorsYen-Ju Lu, Chih-Ming Hung, Wen-Chou Wu
Life of this patent
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Abstract
A radar module includes a printed circuit board (PCB) and a semiconductor package mounted on the PCB. The semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the PCB. The substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radar signals. A discrete pattern-shaping device is mounted on the PCB and is configured to shape a radiation pattern of the radar signals.
Claims18
1-14. (canceled)
A radio frequency module, comprising:
- a base having a first surface and a second surface opposite to the first surface;
- a semiconductor package mounted on the first surface of the base, wherein the semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the base, wherein the substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radio frequency signals;
- and
- a pattern-shaping device mounted on the first surface of the base configured to shape a radiation pattern of said radio frequency signals, wherein the pattern-shaping device comprises a first protrusion and a second protrusion, wherein at least a portion of the integrated circuit die is between the first and second protrusions or below an area between the first and second protrusions.
A radio frequency module, comprising:
- a base having a first surface and a second surface opposite to the first surface;
- a semiconductor package mounted on the first surface of the base, wherein the semiconductor package comprises an integrated circuit die and a substrate for electrically connecting the integrated circuit die to the base, wherein the substrate comprises an antenna layer integrated into the semiconductor package and electrically connected to the integrated circuit die for at least one of transmitting and receiving radio frequency signals;
- a radio frequency main body housing the base and the semiconductor package, the radio frequency main body comprising a retainer;
- and
- a pattern-shaping device mounted on the retainer configured to shape a radiation pattern of said radio frequency signals, wherein the pattern-shaping device comprises a first protrusion and a second protrusion, wherein at least a portion of the integrated circuit die is between the first and second protrusions or below an area between the first and second protrusions.
Dependencies are inferred from the claim text.