Probes for testing integrated electronic circuits and corresponding production method
AssigneeSTMicroelectronics S.r.l.
InventorAlberto Pagani
Life of this patent
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Abstract
Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.
Claims13
A method, comprising:
- wrapping a probe body made electrically conductive materials in a polymer or resin casing such that an end of the probe body is exposed from a front surface of said casing;
- polishing the exposed end of the probe body at the front surface;
- depositing an electrically conductive contact region having a first hardness value equal to or greater than 300 HV to the polished exposed end of the probe body.
A method for producing a probe, comprising:
- forming a probe body made of an electrically conductive material;
- covering sides and an end the probe body with a protection layer;
- removing the protection layer at the end the probe body and planarizing the probe body at said end to form an active end that is not covered by said protection layer;
- forming on said active end of the probe body an electrically conductive contact region having a first hardness value equal to or greater than 300 HV;
- and
- removing the protection layer from the sides of the probe body.
Dependencies are inferred from the claim text.