Package structure for differential pressure sensor, and electronic device

An electronic device, comprising:

• a package structure for a differential pressure sensor, wherein the package structure further comprises:
• a substrate and a housing, wherein an edge of the housing is fixed to a front side of the substrate, and a first chamber is defined between the housing and the substrate;
• and
• a pressure sensor fixed to the front side of the substrate and disposed in the first chamber, wherein the pressure sensor comprises a second chamber and a pressure sensing layer, and the pressure sensing layer is disposed between the first chamber and the second chamber;
• wherein the first chamber is connected with outside via a first through hole, and the second chamber is connected with the outside via a second through hole;
• and
• a first circuit board, wherein the first circuit board comprises a third through hole, and the third through hole is connected with the second through hole.