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US 2022/0026164 A1Published application
Heat transfer device
AssigneeASUSTeK COMPUTER INC.
InventorsHsin-Chen LIN, Ing-Jer CHIOU
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Abstract
A heat transfer device is provided. The heat transfer device includes a first heat conduction sheet and a second heat conduction sheet. The first heat conduction sheet includes two first rigid parts and a first bendable part connected between the two first rigid parts. The second heat conduction sheet includes two second rigid parts and a second bendable part connected between the two second rigid parts. The two first rigid parts are thermally coupled to the two second rigid parts, respectively. The first bendable portion includes a nonlinear section.
Claims10
A heat transfer device, comprising:
- a first heat conduction sheet, including two first rigid parts and a first bendable part, the first bendable part is connected between the two first rigid parts;
- and
- a second heat conduction sheet, including two second rigid parts and a second bendable part, the second bendable part is connected between the two second rigid parts;
- wherein the two first rigid parts of the first heat conduction sheet are thermally coupled to the two second rigid parts of the second heat conduction sheet, respectively, and the first bendable part includes a first nonlinear section.
1 more element
Dependencies are inferred from the claim text.