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US 2022/0025486 A1Published application
Pure copper plate
AssigneeMitsubishi Materials Corporation
InventorsYuki ITO, Hiroyuki MORI, Hiroyuki MATSUKAWA, Norihisa IIDA, Motohiro HITAKA
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Abstract
This pure copper plate includes Cu having a purity of 99.96 mass % or higher, with a remainder of unavoidable impurities, wherein an amount of P is 2 mass ppm or less, and a total amount of Pb, Se, and Te is 10 mass ppm or less. The amount of S may be in a range of 2 mass ppm or more and 20 mass ppm or less.
Claims9
A pure copper plate comprising:
- Cu having a purity of 99.96 mass % or higher;
- and
- a remainder being unavoidable impurities, wherein
- an amount of P is 2 mass ppm or less, and
- a total amount of Pb, Se, and Te is 10 mass ppm or less.
2 more elements
Dependencies are inferred from the claim text.