Thermal interface material and method for making the same
AssigneeGoogle Inc.
InventorsHuijuan Chen, Michael John Bliss
Life of this patent
Estimating the term…
Abstract
A thermal interface material for forming a layer conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween includes: a matrix material composing 10 wt. % or less of the thermal interface material; a filler dispersed in the matrix material composing at least 80 wt. % of the thermal interface material, the filler including: particles of a first material having a nominal dimension in a range from 1 micron to 100 microns, the first material composing at least 40 wt. % of the thermal interface material; and diamond particles having a nominal dimension of 1,000 nm or less, the diamond particles composing 0.5 wt. % to 5 wt. % of the thermal interface material.
Claims20
A thermal interface material for forming a layer conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween, the compound comprising:
- a matrix material composing 10 wt. % or less of the thermal interface material;
- and
- a filler dispersed in the matrix material composing at least 80 wt. % of the thermal interface material, the filler comprising:
- particles of a first material having a nominal dimension in a range from 1 micron to 100 microns, the first material composing at least 40 wt. % of the thermal interface material;
- and
- diamond particles having a nominal dimension of 1,000 nm or less, the diamond particles composing 0.5 wt. % to 5 wt. % of the thermal interface material.
A system, comprising:
- an integrated circuit device;
- a heat sink;
- and
- a layer of the thermal interface material forming an interface between a surface of the integrated circuit device and a surface of the heat sink.
A method, comprising:
- providing a layer of a thermal interface material between a first component of a device and a second component of the device, the first component comprising an integrated circuit and the thermal interface material comprising diamond nanoparticles and having a thermal conductivity of 6 W/(m K) or more;
- and
- transferring heat from the first component to the second component via the layer of thermal interface material.
Dependencies are inferred from the claim text.