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US 2022/0025167 A1Published application
Resin composition, metal laminate and printed circuit board using same, and method for manufacturing metal laminate
AssigneeDoosan Corporation
InventorsJinsoo LEE, Hyungkyu KIM, Kyeongwoon CHO
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Abstract
A resin composition, a metal laminate, and a printed circuit board which use the resin composition are disclosed. A method for manufacturing the metal laminate is also disclosed. The resin composition contains at least one elastomer selected from the group consisting of a fluoroelastomer or a styrene-based elastomer; a fluororesin filler; and an inorganic filler.
Claims28
A resin composition comprising:
- an elastomer selected from the group consisting of a fluoroelastomer, a styrene-based elastomer, and a combination thereof;
- a fluororesin filler;
- and
- an inorganic filler.
1 more element
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Dependencies are inferred from the claim text.