Micro-electromechanical system device and method of forming the same
AssigneeVanguard International Semiconductor Corporation
InventorsJia Jie Xia, Rakesh Kumar
Life of this patent
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Abstract
The present disclosure relates to a micro-electromechanical system (MEMS) device and a method of forming the same. The MEMS device includes a substrate, a cavity, an interconnection structure and a proof mass. The substrate includes a first surface and a second surface opposite to the first surface. The cavity is disposed in the substrate, extending between the first surface and the second surface. The interconnection structure is disposed on the first surface of the substrate, over the cavity. The proof mass is disposed in the cavity, connected to the interconnection structure, the proof mass having a thickness which is smaller than a thickness of the substrate.
Claims20
A micro-electromechanical system device comprising:
- a substrate, comprising a first surface and a second surface opposite to the first surface;
- a cavity disposed in the substrate, extending between the first surface and the second surface;
- an interconnection structure disposed on the first surface of the substrate, over the cavity;
- and
- a proof mass disposed in the cavity and connected to the interconnection structure, the proof mass having a thickness which is smaller than a thickness of the substrate.
A method of forming a micro-electromechanical system device comprising:
- providing a substrate, the substrate comprising a first surface and a second surface opposite to the first surface;
- forming a cavity in the substrate, the cavity extending between the first surface and the second surface;
- forming an interconnection structure on the first surface of the substrate, over the cavity;
- and
- forming a proof mass in the cavity, connected to the interconnection structure, the proof mass having a thickness which is smaller than a thickness of the substrate.
Dependencies are inferred from the claim text.