Bonding device and bonding method

A bonding device, comprising:

• a supporting assembly, comprising a first supporting body and a second supporting body arranged in a first direction, at least one of the first supporting body and the second supporting body configured to be movable in the first direction, the supporting assembly having an upper surface facing a flexible substrate, the upper surface matching an inner surface of the flexible substrate;
• and
• a stretching assembly, comprising a carrier film and a plurality of driving elements, a central area of the carrier film configured to be attached to the inner surface of the flexible substrate, at least two first driving elements of the plurality of driving elements arranged opposite to each other in the first direction, at least two driving elements of the plurality of driving elements arranged opposite to each other in a second direction, the plurality of driving elements all connected to a peripheral portion of the carrier film, and the plurality of driving elements configured to stretch the peripheral portion of the carrier film and drive the inner surface of the flexible substrate to align with the upper surface of the supporting assembly.