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US 2022/0023997 A1Published application
Synthetic grindstone
AssigneeTokyo Diamond Tools Mfg. Co., Ltd.
InventorKai KYOSHIMA
Life of this patent
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Abstract
A synthetic grindstone (100) for chemo-mechanical grinding a wafer W, comprising: an abrasive grain (101) having a chemo-mechanical grinding action on the wafer W and having a particle diameter of less than 5 μm; a spherical filler (102) formed of a material as hard as or softer than the wafer W and having a particle diameter larger than that of the abrasive grain (101); and a resin binder (103) that integrally binds the abrasive grain (101) and the spherical filler (102).
Claims8
A synthetic grindstone for chemo-mechanical grinding a work material, comprising:
- an abrasive grain having a chemo-mechanical grinding action on the work material and having a particle diameter of less than 5 μm;
- a spherical filler formed of a material as hard as or softer than the work material or an oxide thereof and having a particle diameter larger than that of the abrasive grain;
- and
- a resin binder that integrally binds the abrasive grain and the spherical filler.
1 more element
Dependencies are inferred from the claim text.