A method for installing a sponge brush of a semiconductor chemical mechanical polishing apparatus, wherein the method is implemented by a replacing tool, the replacing tool comprises a first beam, a connection mechanism, a second beam, a first hook, and a second hook, the first beam is connected to the second beam through the connection mechanism, the first hook is fixedly connected to the first beam, a portion of the first hook is configured to be engaged into a concave end of the sponge brush, the second hook is fixedly connected to the second beam, and a portion of the second hook is arranged around a convex end of the sponge brush, the first beam and the second beam are movable relative to each other, so that the first hook is engaged with or detached from the concave end of the sponge brush, and the second hook is engaged with or detached from the convex end of the sponge brush,
- the method comprising:
- engaging the first hook of the replacing tool into the concave end of the sponge brush, and arranging the second hook of the replacing tool around the convex end of the sponge brush to clamp the sponge brush;
- moving the replacing tool to place the concave end of the sponge brush on a driven shaft of the semiconductor chemical mechanical polishing apparatus;
- detaching the first hook of the replacing tool from the concave end;
- applying a driving force to the first hook from the second hook of the replacing tool to engage the concave end of the sponge brush with the driven shaft, and assembling the convex end of the sponge brush on a driving shaft of the semiconductor chemical mechanical polishing apparatus;
- and
- detaching the second hook of the replacing tool from the convex end.