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US 2022/0023991 A1Published application
Polishing pads and systems and methods of making and using the same
Assignee3M Innovative Properties Company
InventorsDuy K. Lehuu, Qin Lin, David J. Muradian, Samad Javid
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Abstract
A polishing pad includes a polishing layer having a first major surface and a second major surface opposite the first major surface. The polishing pad further includes a subpad, which is coupled to the polishing layer, and has a first major surface and a second major surface opposite the first major surface. At least 50% of the subpad, based on the total surface area of the first major surface of the subpad, is optically transparent.
Claims16
1) A polishing pad comprising:
- a polishing layer having a first major surface and a second major surface opposite the first major surface;
- a subpad having a first major surface and a second major surface opposite the first major surface,
- wherein the subpad is coupled to the polishing layer;
- and
- wherein at least 50% of the subpad, based on the total surface area of the first major surface of the subpad, is optically transparent.
2 more elements
Dependencies are inferred from the claim text.