Solder joint inspection model training method, solder joint inspection method, and solder joint inspection device

A solder joint inspection method, comprising:

• inputting a to-be-inspected image to a first identification model to obtain a first image, wherein the first identification model is configured to identify a surface-mount device with a solder joint in the to-be-inspected image;
• inputting the first image to a second identification model to obtain a second image, wherein the second identification model is configured to identify the surface-mount device in the first image;
• masking the first image with the second image to generate a third image, and inputting the third image to a solder joint inspection model;
• and
• determining, according to an output result of the solder joint inspection model, whether the solder joint in the to-be-inspected image is abnormal.

A solder joint inspection device, comprising:

• a storage unit configured to store a first identification model, a second identification model and a solder joint inspection model;
• and
• a processor configured to perform the steps of:
• training the first identification model according to a plurality of first sample images to identify a surface-mount device with a solder joint in an image;
• training the second identification model according to a plurality of second sample images to identify a surface-mount device without a solder joint in an image;
• inputting a plurality of labeled original images to a trained first identification model to output a plurality of first images, wherein each of the first images comprises a surface-mount device with a solder joint;
• inputting the first images to a trained second identification model to output a plurality of second images, wherein each of the second images comprises a surface-mount device without a solder joint;
• masking the first images with the second images to generate a plurality of images with normal solder joints and a plurality of images with abnormal solder joints;
• and
• training the solder joint inspection model based on the images with normal solder joints and the images with abnormal solder joints.