Unsealing method of semiconductor device package and unsealing device of semiconductor device package
AssigneeNippon Scientific Co., Ltd.
InventorsNaoto OHTA, Nobutoshi KOBAYASHI
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Abstract
According to an embodiment of the present disclosure, an unsealing method for exposing a semiconductor device package covered by a mold includes the steps of performing a first unsealing process and performing a second unsealing process. The first unsealing process includes a step for irradiating a part of the mold with a laser beam having at least one wavelength band so as to remove an organic resin included in the mold. The second unsealing process includes a step for applying a physical impact to a residue of the mold generated by the first unsealing process so as to expose the semiconductor device.
Claims14
An unsealing method for exposing a semiconductor device package covered by a mold, the unsealing device comprising the steps of:
- performing a first unsealing process, the first unsealing process including a step for irradiating a part of the mold with a laser beam having at least one wavelength band so as to remove an organic resin included in the mold;
- and
- performing a second unsealing process, the second unsealing process including a step for applying a physical impact to a residue of the mold generated by the first unsealing process so as to expose the semiconductor device.
An unsealing device for exposing a semiconductor device package covered by a mold, the unsealing device comprising:
- a first unsealing unit configured to irradiate a part of the mold with a laser beam having at least one wavelength band so as to remove an organic resin included in the mold;
- and
- a second unsealing unit configured to apply a physical impact to the residue of the mold in the part of the mold so as to expose the semiconductor device.
Dependencies are inferred from the claim text.