Hermetic packaging of electronic components
AssigneePixium Vision SA
InventorsMartin DETERRE, Jean-René TENAILLEAU, Theodore I KAMINS
Life of this patent
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Abstract
The present invention relates to the field of electronic devices, in particular implantable electronic devices, e.g. for bio-medical applications, and more particularly, to hermetically packaged electronic devices for bio-medical in vivo applications and packaging methods for such electronic devices.
Claims30
An implantable device comprising an electronic component encapsulated by a hermetic packaging, said packaging comprising a top encapsulation layer and a bottom encapsulation layer, wherein the top and bottom encapsulation layers at least partially overlap so as to form a double layer.
(canceled)
A method for packaging an implantable device, the method comprising
- (a) providing at least one electronic component on a substrate;
- (b) applying at least one top encapsulation layer to the electronic component;
- and
- (c) applying at least one bottom encapsulation layer to the electronic component;
- wherein the top and bottom encapsulation layer layers at least partially overlap so as to form a double layer.
A method for packaging an implantable device, said method comprising the steps of:
- (i) providing an assembly of a plurality of electronic components spaced apart from each other on a substrate, wherein adjacent electronic components and the substrate define a recess in between the electronic components;
- (ii) applying at least one top encapsulation layer to the assembly, thereby coating the electronic components and lining the recess;
- (iii) applying a removable layer to the assembly;
- (iv) partially removing the removable layer, thereby leaving a residual amount of the removable layer within the lined recess;
- (v) upending or flipping the assembly upside down;
- (vi) removing (a) the substrate, (b) the top encapsulation layer and (c) the residual amount of the removable layer from the bottom side of the assembly;
- and
- (vii) applying at least one bottom encapsulation layer to the assembly, thereby coating the electronic components and the recess,
- wherein the top and second bottom encapsulation layers are applied so as to at least partially overlap and forming a double layer.
30-46. (canceled)
Dependencies are inferred from the claim text.