Semiconductor module, power conversion device, and manufacturing method of semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorRyoichi KATO
Life of this patent
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Abstract
A semiconductor module has a heat conduction section provided between a multilayer substrate, on which semiconductor chips are mounted, and a cooler. The heat conduction section includes a frame and an opening, and the opening has a grease portion which is provided partly in the opening and is in contact with the multilayer substrate and the cooler, and a space portion which is provided between the grease portion and the frame in a partial and band-shaped manner.
Claims11
A semiconductor module composed of a multilayer substrate provided with a semiconductor element, and a cooler that cools the multilayer substrate, comprising:
- a heat conduction section provided between the multilayer substrate and the cooler,
- wherein the heat conduction section includes a frame and an opening, and
- the opening has a grease portion which is provided partly in the opening and fills in between the multilayer substrate and the cooler, and a space portion provided between the grease portion and the frame in a partial and band-shaped manner.
A manufacturing method of a semiconductor module composed of a multilayer substrate provided with a semiconductor element, and a cooler that cools the multilayer substrate, comprising at least:
- a step of fabricating a heat conduction section provided between the multilayer substrate and the cooler;
- a step of forming a grease portion which is provided partly in an opening of a frame of the heat conduction section and which fills in between the multilayer substrate and the cooler;
- and
- a step of forming a space portion provided between e grease portion and the frame in a partial and band-shaped manner.
Dependencies are inferred from the claim text.