Heat dissipation device
AssigneeAuras Technology Co., Ltd.
InventorsChih-Wei Chen, Cheng-Ju Chang, Jyun-Wei Huang
Life of this patent
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Abstract
A heat dissipation device is provided and includes: a temperature equalizing plate unit; at least one first vapor chamber unit and at least one second vapor chamber unit disposed on an outer surface of the temperature equalizing plate unit; at least one first tower fin set disposed on the outer surface of the temperature equalizing plate unit to sleeve the first and second vapor chamber units and partially expose the second vapor chamber unit; and at least one second tower fin set disposed on a part of a surface of the first tower fin set to sleeve the exposed part of the second vapor chamber unit.
Claims20
A heat dissipation device, comprising:
- a temperature equalizing plate unit;
- at least one first vapor chamber unit and at least one second vapor chamber unit disposed on an outer surface of the temperature equalizing plate unit;
- at least one first tower fin set disposed on the outer surface of the temperature equalizing plate unit to sleeve the first vapor chamber unit and the second vapor chamber unit and partially expose the second vapor chamber unit;
- and
- at least one second tower fin set disposed on a part of a surface of the first tower fin set to sleeve the exposed part of the second vapor chamber unit.
Dependencies are inferred from the claim text.