Driver board assemblies and methods of forming a driver board assembly
AssigneesToyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
InventorsFeng Zhou, Shohei Nagai
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Abstract
A driver board assembly includes a printed circuit board (PCB) substrate, one or more power devices embedded within the PCB substrate, and a plurality of conductive layers arranged within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices to a current source and thermally couple the one or more power devices to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate.
Claims20
A driver board assembly comprising;
- a printed circuit board (PCB) substrate;
- one or more power devices embedded within the PCB substrate;
- and
- a plurality of conductive layers arranged within the PCB substrate, the plurality of conductive layers configured to electrically couple the one or more power devices to a current source and thermally couple the one or more power devices to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate.
A driver board assembly comprising;
- a PCB substrate;
- one or more power device assemblies comprising:
- a conductive substrate;
- and
- a power device embedded within the conductive substrate, wherein the one or more power device assemblies are embedded within the PCB substrate;
- and
- a plurality of conductive layers arranged within the PCB substrate configured to electrically couple the one or more power device assemblies to a current source and thermally couple the one or more power device assemblies to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate.
A method of forming a driver board assembly, the method comprising:
- arranging one or more power devices within a PCB substrate;
- and
- arranging a plurality of conductive layers within the PCB substrate, the plurality of conductive layers configured to electrically couple the one or more power devices to a current source and thermally couple the one or more power devices to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate.
Dependencies are inferred from the claim text.