Heat sink for a printed circuit board

A heat sink for use with a printed circuit board and a socket engageable with the printed circuit board, the printed circuit board including a first face and a second face opposite the first face, the heat sink comprising:

• a first wall;
• a second wall spaced from the first wall;
• and
• an end wall extending between the first and second walls;
• the first wall, the second wall, and the end wall collectively defining a cavity configured to receive the printed circuit board such that the first wall of the heat sink extends over the first face and the second wall of the heat sink extends over the second face when the printed circuit board is received within the cavity to allow heat to be transferred from the printed circuit board to the heat sink;
• the heat sink being configured to interface with the socket body when the printed circuit board is connected to the socket for stabilizing the printed circuit board relative to the socket.

A circuit board assembly comprising:

• a memory module including:
• a heat sink having a first wall, a second wall spaced from the first wall, and an end wall extending between the first and second walls, the first wall, the second wall, and the end wall collectively defining a cavity;
• and
• a printed circuit board having a circuit board electrical connector, a first face, and a second face opposite the first face, the printed circuit board being located within the cavity of the heat sink such that the first wall of the heat sink extends over the first face and the second wall of the heat sink extends over the second face to allow heat to be transferred from the printed circuit board to the heat sink;
• and
• a socket including:
• a socket body having a channel sized to receive at least the circuit board electrical connector of the printed circuit board;
• and
• at least one locking member pivotable relative to the socket body between a locked configuration and an unlocked configuration, the at least one locking member being in face-to-face contact with the heat sink when the circuit board electrical connector is received within the channel and the at least one locking member is in the locked configuration.