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US 2022/0021990 A1Published application
Vibration module for placement on an eardrum
AssigneeVibrosonic GmbH
InventorsTobias Fritzsche, Daniela Wildenstein
Life of this patent
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Abstract
The invention relates to a vibration module for placing on an eardrum, which vibration module has a flat sound transducer and an eardrum contact mold for contacting the eardrum.
Claims23
A vibration module for placing on an eardrum, the vibration module comprising:
- a flat sound transducer;
- and
- an eardrum contact mold configured to contact the eardrum.
(canceled)
A vibration module for placing on an eardrum, comprising:
- a flat sound transducer;
- an eardrum contact mold configured to contact the eardrum;
- and
- a layer located on a surface of the eardrum contact mold facing away from the flat sound transducer to improve adhesion to the eardrum, wherein the layer comprises at least one of:
- a white oil, fat, a silicon oil, glycerine, or paraffin.
2 more elements
A vibration module for placing on an eardrum, comprising:
- a flat sound transducer;
- an eardrum contact mold configured to contact the eardrum, wherein the flat sound transducer and the eardrum contact mold together enclose an inner volume;
- a layer located on a surface of the eardrum contact mold facing away from the flat sound transducer to improve adhesion to the eardrum, wherein the layer comprises at least one of:
- a white oil, fat, a silicon oil, glycerine, or paraffin;
- and
- a vibration transmission element connected to or in contact with at least one location on a surface of the flat sound transducer and at least one location on a surface of the eardrum contact mold, wherein the vibration transmission element fills at least a portion of the inner volume.
3 more elements
Dependencies are inferred from the claim text.