Loading patent…
AssigneeMurata Manufacturing Co., Ltd.
InventorsAtsushi HORITA, Yukiya YAMAGUCHI, Morio TAKEUCHI, Shigeru TSUCHIDA, Tomoaki SATO, Rui TANAKA
Estimating the term…
A radio-frequency module includes a mounting substrate, a first power amplifier, a second power amplifier, a circuit component (IC chip), and an external connection terminal. The mounting substrate has a first main surface and a second main surface on opposite sides of the mounting substrate. The first power amplifier is mounted on the first main surface of the mounting substrate. The second power amplifier is mounted on the first main surface of the mounting substrate. The circuit component is mounted on the second main surface of the mounting substrate. The external connection terminal is disposed on the second main surface of the mounting substrate. The external connection terminal is connected to a power supply that supplies a power supply voltage to the first power amplifier and the second power amplifier.
A radio-frequency module comprising:
A communication device comprising:
Dependencies are inferred from the claim text.