Dielectric Filter, Transceiver Device, and Base Station
AssigneeHuawei Technologies Co., Ltd.
InventorsTao JIANG, Jiyong GUO
Life of this patent
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Abstract
Example dielectric filters, transceiver devices, and base stations are described. One example dielectric filter includes a dielectric block whose surface is covered with a metal layer, where the dielectric block includes at least two resonant cavities. The dielectric block is provided with a via hole, the via hole is located between two adjacent resonant cavities, and an inner wall of the via hole is covered with a metal layer. A first partition ring is disposed on the surface of the dielectric block and is surrounding at least one opening of the via hole, and the dielectric block is exposed in an area enclosed by an inner edge of the first partition ring and an outer edge of the first partition ring.
Claims16
A dielectric filter, comprising a dielectric block whose surface is covered with a metal layer, wherein the dielectric block comprises at least two resonant cavities, and wherein:
- the dielectric block is provided with a via hole, the via hole is located between two adjacent resonant cavities, and an inner wall of the via hole is covered with a metal layer;
- and
- a first partition ring is disposed on the surface of the dielectric block and is surrounding at least one opening of the via hole, and the dielectric block is exposed in an area enclosed by an inner edge of the first partition ring and an outer edge of the first partition ring.
A transceiver device, comprising a dielectric filter, wherein the dielectric filter comprises a dielectric block whose surface is covered with a metal layer, [[and]] wherein the dielectric block comprises at least two resonant cavities, and wherein:
- the dielectric block is provided with a via hole, the via hole is located between two adjacent resonant cavities, and an inner wall of the via hole is covered with a metal layer;
- and
- a first partition ring is disposed on the surface of the dielectric block and is surrounding at least one opening of the via hole, and the dielectric block is exposed in an area enclosed by an inner edge of the first partition ring and an outer edge of the first partition ring.
Dependencies are inferred from the claim text.