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US 2022/0020924 A1Published application
Electronic component manufacturing method
AssigneeSTMicroelectronics (Crolles 2) SAS
InventorsYann CANVEL, Sebastien LAGRASTA, Sebastien BARNOLA, Christelle BOIXADERAS
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Abstract
The disclosure concerns an electronic component manufacturing method including a first step of etching at least one first layer followed, with no exposure to oxygen, by a second step of passivating the first layer.
Claims20
A method, comprising:
- depositing a first passivation layer on a phase change material;
- etching a resistive layer below the first passivation layer while the first passivation layer is on the phase change material;
- and
- depositing a second passivation layer on the phase change material and on the resistive layer.
1 more element
A method, comprising:
- manufacturing a phase change memory cell, the manufacturing including:
- forming a layer of phase change material on a resistive layer;
- forming a mask layer on the layer of phase change material;
- etching the phase change material while the mask layer is on the phase change material layer;
- depositing a first passivation layer on the layer of phase change material layer;
- and
- etching the resistive layer while the first passivation layer is on the layer of phase change material.
4 more elements
A method, comprising:
- manufacturing an electronic component, the manufacturing including:
- depositing a resistive layer;
- depositing a layer of phase change material on the resistive layer;
- depositing a mask layer on the layer of phase change material;
- etching the layer of phase change material;
- depositing a first passivation layer on the layer of phase change material;
- etching the layer of resistive material after depositing the first passivation layer;
- removing the mask layer after etching the resistive layer;
- and
- depositing a second passivation layer on the resistive layer and the layer of phase change material after removing the mask layer.
7 more elements
Dependencies are inferred from the claim text.