Method for Producing an Optoelectronic Device
AssigneeOSRAM Opto Semiconductors GmbH
InventorsGregory Bellynck, Ivar Tangring
Life of this patent
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Abstract
In an embodiment a method includes providing a carrier with an optoelectronic semiconductor chip-component arranged on a top side of the carrier, arranging a first potting material on the top side of the carrier, arranging a second potting material on the first potting material, wherein the second potting material comprises a higher density than the first potting material, wherein a top side of the optoelectronic semiconductor chip-component is covered by neither the first potting material nor the second potting material and allowing a force to act on the first potting material and the second potting material such that the second potting material migrates in a direction toward the top side of the carrier.
Claims19
-18. (canceled)
A method for producing an optoelectronic device, the method comprising:
- providing a carrier with an optoelectronic semiconductor chip-component arranged on a top side of the carrier;
- arranging a first potting material on the top side of the carrier;
- arranging a second potting material on the first potting material,
- wherein the second potting material comprises a higher density than the first potting material,
- wherein a top side of the optoelectronic semiconductor chip-component is covered by neither the first potting material nor the second potting material;
- and
- allowing a force to act on the first potting material and the second potting material such that the second potting material migrates in a direction toward the top side of the carrier.
Dependencies are inferred from the claim text.