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US 2022/0020893 A1Published application
System and methods for managing heat in a photonic integrated circuit
AssigneeAcacia Communications, Inc.
InventorJohn Heanue
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Abstract
In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.
Claims13
A system, comprising:
- a photonic integrated circuit (PIC) assembly, comprising:
- a PIC comprising:
- a first bond pad disposed inward from an edge of the PIC a first distance;
- and
- a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than about 0.4 mm.
2 more elements
A method of manufacturing an optical transceiver, the method comprising:
- providing a housing comprising
- an interior surface and exterior surface;
- a plurality of pins extending outward from the exterior surface of the housing;
- an interior volume at least partially enclosed within the housing;
- and
- a plurality of connectors along the interior surface of the housing electrically connected to the plurality of pins;
- coupling a PIC assembly to the packaging within the interior volume of the packaging, wherein the PIC assembly includes a plurality of bond pads;
- and
- electrically connecting each of the bond pads uniquely to a connector of the plurality of connectors along the interior surface of the housing with a bonding wire at least partially rounded across the distance between each of the bond pads and the associated connector, wherein a length of the bond wire is greater than a distance between each of the bond pads and the associated connector.
6 more elements
Dependencies are inferred from the claim text.