Monolithic semiconductor device assemblies
AssigneeSemiconductor Components Industries, LLC
InventorsPeter MOENS, Gordon M. GRIVNA, Yusheng LIN
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AssigneeSemiconductor Components Industries, LLC
InventorsPeter MOENS, Gordon M. GRIVNA, Yusheng LIN
Estimating the term…
In a general aspect, a semiconductor device assembly can include a semiconductor substrate that excludes a buried oxide layer. The semiconductor device assembly can also include a first semiconductor device stack disposed on a first portion of the semiconductor substrate, and a second semiconductor device stack disposed on a second portion of the semiconductor substrate. The semiconductor device assembly can further include an isolation trench having a dielectric material disposed therein, the isolation trench being disposed between the first portion of the semiconductor substrate and the second portion of the semiconductor substrate. The isolation trench can electrically isolate the first portion of the semiconductor substrate from the second portion of the semiconductor substrate.
A semiconductor device assembly comprising:
A semiconductor device assembly comprising:
A semiconductor device assembly, comprising:
Dependencies are inferred from the claim text.