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US 2022/0020809 A1Published application
Packaging structure, electronic device, and method for manufacturing the packaging structure
AssigneeTriple Win Technology(Shenzhen) Co.Ltd.
InventorHSIN-YEN HSU
Life of this patent
Estimating the term…
Abstract
A packaging structure for an image sensor used in an electronic device includes a flexible circuit board, a reinforcing plate, an image sensor, and an adhesive layer. The reinforcing plate is disposed on the flexible circuit board. The image sensor is disposed in the reinforcing plate. The adhesive layer bonds the flexible circuit board, the reinforcing plate, the image sensor and the conductor.
Claims16
A packaging structure, comprising:
- a flexible circuit board comprising a first opening and a protruding portion surrounding the first opening;
- a reinforcing plate disposed on the flexible circuit board, the reinforcing plate comprising a second opening connecting to the first opening, and the protruding portion protruding from a periphery of the second opening toward a center axis of the second opening;
- an image sensor comprising a photosensitive area and a connecting area surrounding the photosensitive area, the image sensor disposed in the second opening, the connecting area electrically connected to the protruding portion through a conductor, the photosensitive area exposed from the first opening;
- and
- an adhesive layer bonding together the protruding portion, the reinforcing plate, the connecting area, and the conductor.
2 more elements
An electronic device, comprising:
- a packaging structure comprising:
- a flexible circuit board comprising a first opening and a protruding portion surrounding the first opening;
- a reinforcing plate disposed on the flexible circuit board, the reinforcing plate comprising a second opening connecting to the first opening, and the protruding portion protrudes from a periphery of the second opening toward a center axis of the second opening;
- an image sensor comprising a photosensitive area and a connecting area surrounding the photosensitive area, the image sensor disposed in the second opening, the connecting area electrically connected to the protruding portion through a conductor, the photosensitive area exposed from the first opening;
- and
- an adhesive layer bonding together the protruding portion, the reinforcing plate, the connecting area, and the conductor.
3 more elements
A method for manufacturing the packaging structure, the method comprising:
- providing a flexible circuit board comprising a first opening a protruding portion surrounding the first opening;
- disposing a reinforcing plate on the flexible circuit board;
- the reinforcing plate comprising a second opening corresponding to the first opening;
- disposing an image sensor in the second opening, the image sensor being spaced apart from the reinforcing plate and the flexible circuit board, the image sensor comprising a photosensitive area and a connecting area, the photosensitive area corresponding to the first opening, and the connecting area corresponding to the protruding portion;
- forming a conductor between the protruding portion and the connecting area;
- and
- filling an adhesive layer among the protruding portion, the reinforcing plate, the connecting area, and the conductor.
4 more elements
Dependencies are inferred from the claim text.