Methods of Incorporating Leaker Devices into Capacitor Configurations to Reduce Cell Disturb, and Capacitor Configurations Incorporating Leaker Devices

An integrated assembly, comprising:

• a row of conductive posts;
• the conductive posts being spaced from one another by gaps;
• the gaps alternating between first gaps and second gaps;
• the first gaps having leaker device material extending between neighboring posts and the second gaps not having the leaker device material therein;
• an insulative material along sidewalls of the conductive posts;
• and
• a conductive structure over the conductive posts and having first and second downward projections extending into the first and second gaps, respectively;
• the first downward projections extending through the leaker device material and being directly against the leaker device material;
• the second downward projections extending further than the first downward projections to be deeper than the first downward projections.

A method of forming an integrated assembly, comprising:

• forming conductive posts over access devices;
• the conductive posts being spaced from one another by gaps;
• leaker device material being within the gaps and contacting sidewalls of the posts;
• removing segments of the leaker device material to form a configuration having a row of the posts along a cross-section;
• the row having the gaps between the posts with the gaps alternating between first gaps and second gaps;
• the first gaps having the leaker device material therein, and the second gaps not having the leaker device material therein;
• the second gaps being deeper than the first gaps due to at least the leaker device material within the first gaps;
• forming insulative-capacitor-material within the first and second gaps and along the sidewalls of the posts;
• the insulative-capacitor-material lining the first and second gaps and extending along bottom peripheries of the first gaps;
• forming first conductive material over the posts and within the first and second gaps;
• the first conductive material being over the insulative-capacitor-material;
• forming openings to extend through the first conductive material and the insulative-capacitor-material along the bottom peripheries of the first gaps, the openings penetrating through the leaker device material;
• and
• filling the openings with second conductive material;
• the first and second conductive materials together forming a conductive structure;
• the second conductive material within the openings being configured as downward projections of the conductive structure;
• the leaker device material extending from the downward projections of the conductive structure to neighboring conductive posts and directly contacting the conductive structure and the neighboring conductive posts;
• the conductive structure, insulative-capacitor-material and conductive posts together forming a plurality of capacitors.