Isolated 3d semiconductor device package
AssigneeSemiconductor Components Industries, LLC
InventorsTiburcio A. MALDO, Keunhyuk LEE, Jerome TEYSSEYRE
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Abstract
Described implementations provide wireless, surface mounting of at least two semiconductor devices on opposed surfaces of a leadframe, to provide an isolated, three-dimensional (3D) configuration. The described implementations minimize electrical failures, even for very high voltage applications, while enabling low inductance and high current. Resulting semiconductor device packages have mounting surfaces that provide desired levels of isolation and insulation, while still enabling straightforward mounting techniques, such as soldering, as well as high levels of thermal reliability.
Claims20
A semiconductor device package, comprising:
- a leadframe having a first surface and a second, opposed surface, and having a first portion and a second portion that is laterally opposed from the first portion;
- an L-shaped substrate having a diode attached thereto, the diode being connected to the first portion on the first surface, and the L-shaped substrate being connected to the second portion on the first surface;
- and
- a transistor attached to a substrate and to the leadframe, the transistor being connected to the first portion and the second portion, on the second, opposed surface, by way of a conductive layer of the substrate.
A method of making a semiconductor device package, comprising:
- attaching a diode to an L-shaped substrate;
- attaching the diode to a first portion of a first surface of a leadframe;
- attaching the L-shaped substrate to a second portion of the first surface that is laterally opposed from the first portion;
- attaching a transistor to a substrate;
- and
- attaching the transistor to the first portion of the leadframe and to the second portion of the leadframe, on a second, opposed surface of the leadframe, and connected using a conductive layer of the substrate.
A semiconductor device package, comprising:
- a first transistor attached to a first substrate and to a first surface of a leadframe, with first transistor power leads on a side of the leadframe;
- and
- a second transistor attached to a second substrate and to a second surface of the leadframe, with second transistor power leads on the side of the leadframe.
A method of making a semiconductor device package, comprising:
- attaching a first transistor to a first substrate;
- attaching the first transistor and the first substrate onto a first surface of a leadframe, with first transistor power leads on a side of the leadframe;
- attaching a second transistor to a second substrate;
- and
- attaching the second transistor and the second substrate onto a second, opposed surface of the leadframe, with second transistor power leads on the side of the leadframe.
Dependencies are inferred from the claim text.