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US 2022/0020729 A1Published application
Molded direct bonded and interconnected stack
AssigneeInvensas Bonding Technologies, Inc.
InventorsGuilian GAO, Cyprian Emeka UZOH, Jeremy Alfred THEIL, Belgacem HABA, Rajesh KATKAR
Life of this patent
Estimating the term…
Abstract
Dies and/or wafers are stacked and bonded in various arrangements including stacks, and may be covered with a molding to facilitate handling, packaging, and the like. In various examples, the molding may cover more or less of a stack, to facilitate connectivity with the devices of the stack, to enhance thermal management, and so forth.
Claims26
A microelectronic assembly, comprising:
- a first substrate having a first bonding surface and a first microelectronic circuit element embedded into the first substrate, a portion of the first circuit element of the first substrate exposed at the first bonding surface of the first substrate;
- a second substrate having a first bonding surface and a first microelectronic circuit element embedded into the second substrate, a portion of the first circuit element of the second substrate exposed at the first bonding surface of the second substrate, the first bonding surface of the second substrate hybrid bonded to the first bonding surface of the first substrate, coupling the first substrate to the second substrate and forming a stack;
- a first molding covering the side edges of at least the second substrate of the stack, forming a molded stack;
- a semiconductor interposer, the molded stack hybrid bonded to the interposer;
- and
- a second molding covering the molded stack and covering at least side edges of the interposer.
3 more elements
A microelectronic assembly, comprising:
- a plurality of adjacent stacks of multiple microelectronic elements, each stack comprising:
- a first substrate having a first bonding surface and a first microelectronic circuit element embedded into the first substrate, a portion of the first circuit element of the first substrate exposed at the first bonding surface of the first substrate;
- a second substrate having a first bonding surface and a first microelectronic circuit element embedded into the second substrate, a portion of the first circuit element of the second substrate exposed at the first bonding surface of the second substrate, the first bonding surface of the second substrate hybrid bonded to the first bonding surface of the first substrate, electrically coupling the first substrate to the second substrate without adhesive and forming a stack;
- and
- a first molding covering the side edges of at least the second substrate of each stack, including the side edges facing side edges of an adjacent stack.
2 more elements
-35. (canceled)
Dependencies are inferred from the claim text.