Chip-carrying structure and chip-bonding method
AssigneeSkiileux Electricity Inc.
InventorsCHIEN-SHOU LIAO, TE-FU CHANG, Sheng-Che Huang, YU-MIN HUANG
Life of this patent
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Abstract
A chip-carrying structure and a chip-bonding method are provided. The chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters disposed on or inside the circuit substrate, and a micro heater control chip electrically connected to the micro heaters. Therefore, when a chip is disposed on two corresponding ones of the conductive materials, the micro heater control chip is configured to control a corresponding one of the micro heaters to start or stop heating the two corresponding conductive materials according to chip movement information of the chip.
Claims18
A chip-bonding method, comprising:
- providing a chip-carrying structure, wherein the chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters disposed on or inside the circuit substrate, and a micro heater control chip electrically connected to the micro heaters;
- carrying a chip by the chip-carrying structure, wherein the chip is disposed on two corresponding ones of the conductive materials;
- controlling a corresponding one of the micro heaters to heat the two corresponding conductive materials by control of the micro heater control chip according to chip movement information of the chip;
- and
- bonding the chip on the chip-carrying structure by heating and cooling the two corresponding conductive materials.
A chip-carrying structure, comprising:
- a circuit substrate for carrying a plurality of conductive materials;
- a plurality of micro heaters disposed on or inside the circuit substrate;
- and
- a micro heater control chip electrically connected to the micro heaters;
- wherein, when a chip is disposed on two corresponding ones of the conductive materials, the micro heater control chip is configured to control a corresponding one of the micro heaters to start or stop heating the two corresponding conductive materials according to chip movement information of the chip.
A chip-carrying structure, comprising:
- a circuit substrate for carrying a plurality of conductive materials;
- a plurality of micro heaters disposed on or inside the circuit substrate;
- and
- a micro heater control chip electrically connected to the micro heaters.
Dependencies are inferred from the claim text.