Multi-segment wire-bond
AssigneeSemiconductor Components Industries, LLC
InventorElmer Cunanan BAYRON
Life of this patent
Estimating the term…
Abstract
A multifaceted capillary that can be used in a wire-bonding machine to create a multi-segment wire-bond is disclosed. The multifaceted capillary is shaped to apply added pressure and thickness to an outer segment of the multi-segment wire-bond that is closest to the wire loop. The added pressure eliminates a gap under a heel portion of the multi-segment wire-bond and the added thickness increases a mechanical strength of the heel portion. As a result, a pull test of the multi-segment wire-bond may be higher than a single-segment wire-bond and the multi-segment wire-bond may resist cracking, lifting, or breaking.
Claims20
A multi-segment wire-bond comprising:
- a heel portion that includes multiple segments, the multiple segments including:
- a first segment that increases from a first thickness to a second thickness according to a first side cross-sectional profile over a first segment length;
- a second segment that increases from the second thickness to a third thickness according to a second side cross-sectional profile over a second segment length, the second profile being different from the first profile;
- and
- a third segment that increases from the third thickness to a fourth thickness according to a third side cross-sectional profile over a third segment length, the third profile being different from the second profile and the first profile;
- the heel portion having continuous contact between a bonding surface and the first segment, the second segment, and the third segment.
A multifaceted capillary for a wire-bonding machine, the multifaceted capillary comprising:
- a wire channel;
- a first face having a first face profile that includes a first surface at a first face angle with respect to a bonding surface;
- a second face having a second face profile that includes a second surface at a second face angle with respect to the bonding surface, the second face angle being different than the first face angle, the first face being disposed between the second face and the wire channel;
- and
- a third face having a third face profile that includes a curve having a plateau region that is substantially aligned parallel with the bonding surface, the second face being disposed between the first face and the third face.
A method for wire-bonding comprising:
- feeding a wire through a wire channel of a multifaceted capillary of a wire-bonding machine;
- applying a force to press the wire between a bottom surface of the multifaceted capillary and a bonding surface of a substrate, the bottom surface including:
- a first face, adjacent to a wire channel, having a first face profile that includes a first surface at a first face angle with the bonding surface;
- a second face, adjacent to the first face, having a second face profile that includes a second surface at a second face angle with the bonding surface;
- and
- a third face, adjacent to the second face, having a third face profile that includes a curve having a plateau region that is substantially aligned with the bonding surface;
- and
- delivering power to the wire to form a multi-segment wire-bond, the multi-segment wire-bond having no gap between the bonding surface and a heel portion, the heel portion of the multi-segment wire-bond including a plateau region having a thickness that is greater than or equal to half of a diameter of the wire.
Dependencies are inferred from the claim text.