Depth-Adaptive Mechanism for Ball Grid Array Dipping
AssigneeGoogle Inc.
InventorFan Li
Life of this patent
Estimating the term…
Abstract
This document describes systems and techniques of a depth-adaptive mechanism for ball grid array dipping. In an aspect, a depth-adaptive mechanism having a tensioned mesh is positioned in a reservoir filled with flux. When solder balls of an integrated circuit component are dipped into the reservoir of flux, the solder balls are pressed up against the tensioned mesh. The tensioned mesh is configured to, first, elastically deform under the downward force applied by the solder balls and, second, provide an equal and opposite pushing force in order to facilitate solder ball extraction. In so doing, the solder balls of an integrated circuit component can be more easily extracted from flux when deep ball grid array dipping is performed.
Claims7
A system comprising:
- a reservoir configured to store flux for dipping an array of solder balls;
- and
- a depth-adaptive mechanism disposed within the reservoir, the depth-adaptive mechanism comprising:
- a frame, constituting a support structure, having at least two walls;
- and
- a flexible mesh material secured by the at least two walls of the frame in a planar orientation that is substantially parallel to a surface of the flux and is at a predefined distance below the surface of the flux, the flexible mesh material tensioned between the at least two portions of the support structure to provide a reaction force that reacts to a pushing force associated with the array of solder balls being pressed against the flexible mesh material.
Dependencies are inferred from the claim text.