Laser compression bonding device and method for semiconductor chip

A laser compression bonding device for a semiconductor chip, the device comprising:

• a conveyor unit configured to transport a semiconductor chip and a substrate which are received in a pre-bonding zone and on which bonding is then performed in a main bonding zone, to an unloading zone;
• and
• a bonding head that comprises:
• a bonding tool configured to apply a pressure to the semiconductor chip and the substrate;
• a laser beam generator installed over the bonding tool and configured to emit a laser beam for bonding between the semiconductor chip and the substrate, the laser beam passing through the bonding tool;
• a thermal imaging camera configured to measure a temperature of each of the surfaces of the semiconductor chip and the substrate;
• a compression unit configured to control a pressure applied by the bonding tool and a position thereof;
• a vision alignment unit configured to align a position of the semiconductor chip;
• and
• a Z-axis shaft vertical-movement motor, wherein
• the compression unit comprises:
• a mount on which the bonding tool is detachably mounted;
• and
• a servo motor and a load cell which are configured to apply a pressure to the mount in the Z-axis direction or control a position thereof in a finely graded manner, and
• the servo motor is controlled with two target values for pressure application and positioning.