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US 2022/0020704 A1Published application
Die stack with reduced warpage
AssigneeIntel Corporation
InventorsYong She, Bin Liu, Zhicheng Ding, Aiping Tan
Life of this patent
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Abstract
A microelectronic device can include a polymer, a semiconductor, and a matching layer. The polymer can include a first coefficient of thermal expansion. The semiconductor can be coupled to the polymer layer. The matching layer can be adjacent the semiconductor, and the matching layer can include a second coefficient of thermal expansion that is about the same as the first coefficient of thermal expansion.
Claims21
(canceled)
An electronic device, comprising:
- a first layer including a first polymer material and one or more electrical traces, wherein the first polymer material has a first coefficient of thermal expansion;
- a second layer including a semiconductor material, wherein the first layer is attached to a first side of the second layer;
- a third layer including a second polymer material having a second coefficient of thermal expansion, wherein the third layer is attached to a second side of the second layer;
- and
- wherein the first coefficient of thermal expansion is substantially similar to the second coefficient of thermal expansion.
2 more elements
An electronic device, comprising:
- a plurality of die including a first die attached to a second die, each of the plurality of die including:
- a first layer including a first polymer material and one or more electrical traces, wherein the first polymer material has a first coefficient of thermal expansion;
- a second layer including a semiconductor material, wherein the first layer is attached to a first side of the second layer;
- a third layer including a second polymer material having a second coefficient of thermal expansion, wherein the third layer is attached to a second side of the second layer;
- and
- wherein the first coefficient of thermal expansion is substantially similar to the second coefficient of thermal expansion.
3 more elements
An electronic device, comprising:
- a substrate;
- a plurality of die including a first die and a second die, each of the plurality of die including:
- a first layer including a first polymer material and one or more electrical traces, wherein the first polymer material has a first coefficient of thermal expansion:
- a second layer including a semiconductor material, wherein the first layer is attached to a first side of the second layer;
- and
- a third layer including a second polymer material having a second coefficient of thermal expansion, wherein the third layer is attached to a second side of the second layer;
- a fourth layer including a third polymer material having a third coefficient of thermal expansion, wherein the fourth layer is attached to the first layer opposite the second layer;
- and
- wherein each of the first coefficient of thermal expansion, the second coefficient of thermal expansion, and the third coefficient of thermal expansion are substantially similar.
6 more elements
Dependencies are inferred from the claim text.