Semiconductor device

A semiconductor device comprising:

• a plurality of semiconductor chips each including a first main electrode on one of main surfaces and including a second main electrode and a control electrode on another main surface;
• a first common main electrode with one of main surfaces connected to the respective first main electrodes of the semiconductor chips;
• and
• a printed board including an insulating layer with one of main surfaces separately opposed to the other main surface of the respective semiconductor chips, a control wiring part provided on the one main surface of the insulating layer to be electrically connected to the respective control electrodes, a main wiring part provided on the one main surface of the insulating layer and arranged adjacent to the control wiring part to be electrically connected to the respective second main electrodes, a common control electrode provided on another main surface of the insulating layer and located at a position at least partly overlapping with the control wiring part via the insulating layer in a plan view, a second common main electrode provided on the other main surface of the insulating layer and located at a position at least partly overlapping with the control wiring part and the main wiring part via the insulating layer in the plan view, a first metal layer provided on an inner wall of a first penetration hole penetrating the control wiring part, the insulating layer, and the common control electrode to electrically connect the control wiring part and the common control electrode via the first penetration hole, and a second metal layer provided on an inner wall of a second penetration hole penetrating the main wiring part, the insulating layer, and the second common main electrode to electrically connect the main wiring part and the second common main electrode via the second penetration hole.