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US 2022/0020698 A1Published application
Electronic package and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering Korea, Inc.
InventorsSeokbong KIM, Eunshim LEE
Life of this patent
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Abstract
The present disclosure provides an electronic package and method of manufacturing the same. The electronic package includes an electronic device including a first carrier and a first electronic component disposed on the first carrier, a second carrier adjacent to the first carrier of the electronic device, and a conductive layer at least partially covering the electronic device, and separating the electronic device from the second carrier.
Claims21
An electronic package, comprising:
- an electronic device comprising a first carrier and a first electronic component disposed on the first carrier;
- a second carrier adjacent to the first carrier of the electronic device;
- and
- a conductive layer at least partially covering the electronic device, and separating the electronic device from the second carrier.
1 more element
An electronic package, comprising:
- a first substrate;
- an electronic device disposed over the first substrate, wherein the electronic device comprises a first carrier and a first electronic component disposed on the first carrier, and the electronic device includes an upper surface and a first edge;
- a second carrier disposed over the first substrate, wherein the second carrier is adjacent to the first edge of the electronic device and apart from the first edge with a gap;
- and
- a conductive lid mounted on the first substrate, the conductive lid comprises a cap covering the upper surface, and a first sidewall penetrating through the cap to cover the first edge of the electronic device.
2 more elements
(canceled)
Dependencies are inferred from the claim text.