Module and method of manufacturing the same

A module comprising:

• a substrate;
• a component mounted on a surface of the substrate;
• a first sealing resin that covers the substrate and the component;
• a shield film that covers the first sealing resin and that includes a conductive layer and a protective layer, with the conductive layer being formed of a material having a different color and a lower laser absorption coefficient than a material of the protective layer;
• and
• a marking section that is not covered by the protective layer and from which the conductive layer is visually exposed to the outside of the module.

A method of manufacturing a module, the method comprising:

• preparing a module blank that includes:
• a substrate having a first main surface,
• a component mounted on the first main surface,
• a first sealing resin covering the first main surface and the component, and
• a shield film covering at least a surface of the first sealing resin that is opposite the first main surface of the substrate, with the shield film including a protective layer and a conductive layer covered by the protective layer;
• and
• forming a marking section by irradiating an upper surface of the module blank with a laser beam in a nitrogen atmosphere to form a recess that visually exposes the conductive layer to an outside of the module,
• wherein a surface of the conductive layer closer to the protective layer comprises a color that is different from a color of the protective layer, and
• wherein a material of the protective layer has a laser absorption coefficient that is higher than a laser absorption coefficient of a material forming the conductive layer.