Composite component and method for manufacturing the same

A method for manufacturing a composite component, the method comprising:

• forming an adhesive layer on a Si base layer;
• adhering an electronic component onto the Si base layer with the adhesive layer interposed therebetween;
• bonding a Si support on the electronic component;
• thinning the Si base layer;
• forming a through hole in the thinned Si base layer and the adhesive layer to expose a component electrode of the electronic component;
• and
• forming a through Si via in the through hole by electrolytic plating.

A method for manufacturing a composite component, the method comprising:

• forming an adhesive layer on a Si base layer;
• adhering an electronic component on the Si base layer with the adhesive layer interposed therebetween;
• sealing the electronic component with a resin to form an integrated electronic component layer;
• bonding a Si support on the electronic component layer;
• thinning the Si base layer;
• forming a through hole in the thinned Si base layer and the adhesive layer to expose a component electrode of the electronic component;
• and
• forming a through Si via in the through hole by electrolytic plating.